# THS6212 - THS6232 - COS6212?

A cursory look at their electrical characteristics and interchangability.

The selection of devices is a heterogenous assortment of quasi footprint compatible powerline comms (PLC) / ADSL line drivers, which differ in many parameters including backside wafer processing / die attach method. The VCM bypass capacitor is optional and pins 5-16 are most often NC.

All devices support GND at VS- potential as well as supply midpoint.

However, if EP needs to be connected to GND, only THS6212 can be used.

Also note: the inputs are generally severely limited in their swing or common-mode range, like +/- 2.5 to +/- 3V around (VS+ - VS-)/2. Unipolar supply with inputs near VS- is not possible.

COS6212, THS6222 and THS6232 imply AC-coupled inputs altough the internal buffer and bias resistors may well support pulling to an external midpoint. OPA2673 added for lower-voltage part comparison.

| Part | Supply Range | GND Range | EP Connection | Extras |
| ------- | ------------ | --------------- | ------------------- | ------------------------------- |
| THS6212 | 10 .. 28 V | VS– .. VS+ -5 | isolated from die | - |
| THS6222 | 8 .. 32 V | VS– .. VS+ -5 | VS- , die substrate | input bias, VCM pin |
| THS6232 | 7 .. 40 V | VS– .. VS+ -5 | VS- , die substrate | input bias |
| COS6212 | 8 .. 40 V | Vs– .. Vs+ -5 | VS- , die substrate | input bias, VCM pin, fault flag |
| OPA2673 | 5.75 .. 13 V | Vs– .. Vs+ -2.5 | VS- , die substrate | VQFN16 |

It appears to me that COS6212 is a remix of the three designs offered by Ti (potentially acquired, I haven't researched the origins - might as well be Burr-Brown or something). It matches the THS6232 voltage range, but also breaks out VCM for external bypass capacitance.

COS6212 is also not a susbstitute for THS6212 but rather THS6232 as far as features and supply range are concerned.
The comparison of bandwidth, voltage swing, loading and drive currents is beyond the scope of exploration presented herein.

Among all four, only THS6212 has an isolated die, and the worst voltage rating of the lot.

> [!WARNING]
> Connect the exposed pad (EP) to VS- for interchangability.
> Only THS6212 features an isolated substrate package and therefore supports EP-to-GND connection at supply midpoint.

> [!NOTE]
> All devices support GND at supply mid-point potential.

## COS6212

https://wmsc.lcsc.com/wmsc/upload/file/pdf/v2/C2972780.pdf
https://www.lcsc.com/product-detail/C2972780.html



EP: Electrically connected to die substrate and VS–.
Connect to VS– on the printed circuit board (PCB)
for best performance.

## THS6212

https://www.ti.com/lit/ds/symlink/ths6212.pdf

EP: Solder the exposed thermal pad to a heat-spreading power
or ground plane. This pad is electrically isolated from the die,
but must be connected to a power or ground plane and not floated



THS6212 EVM:

https://www.ti.com/lit/ug/sbou171/sbou171.pdf


## THS6222

https://www.ti.com/lit/ds/symlink/ths6222.pdf

EP: Electrically connected to die substrate and VS–. Connect
to VS– on the printed circuit board (PCB) for best performance.


## THS6232

https://www.ti.com/lit/ds/symlink/ths6232.pdf

EP: Electrically connected to die substrate and VS–. Connect
to VS– on the printed circuit board (PCB) for best performance


## OPA2673

(Not part of the THX62x2 clustering but mentioned in passing as another reference point for a high current PLC line driver)

https://www.ti.com/lit/ds/symlink/opa2673.pdf