Full Customer company name (Name appearing on report):
客戶的全名
Ex: Lite-On tech co. ltd.
Customer contact name:
填代理商 FAE/Sales
E-mail address( register an MyMicrochip account):
填寫 有註冊過"MyMicrochip"
Application Details of this part:
填寫詳細的應用產品
Automotive Customer?
車用的產品則一定要勾選
Special Instructions for FA If Yes, please describe:
Ex: 非常溫下,在高溫 - 80℃
分析過程中,一定要特別註明的
Customer Part #:
客戶廠內的 Part No.
Microchip Part no (CPN)#:
Customer Tracking #:
客戶自己的FA追蹤碼,若沒有 可不寫
Failure Rate (rej qty/total qty):
發生issue的數量/工廠當批生產的數量
How many sample for FA:
送分析的數量
Trace code of FA sample: Qty:
填寫 送分析IC的上面的 trace code yymmxxx (Date code + rand number)
Ex: 送3顆,有2種 trace code : 2103QWE x 1pcs, 2109ASD x 2pcs
Trace code of FA sample: 2103QWE Qty: 1
Trace code of FA sample: 2109ASD Qty: 2
Package : CSP 包裝太小,看不到 Trace code 要請客戶自己記錄下來,在出貨的外包裝上有註明。
P.S. 提供"assembly lot number"也是可以。
生產線有問題,是看當下的生產線上的量
Engineering Samples
客戶自己的"Enginnering Samples"
有可能非經正常的生產線測試, 所以要特別註記
Field Failure( Enter using hours or Km in Full Descriptions of Issue)
是 relibiltiy 問題
Assembly Plant (0 km)
Line Pull(PCBA)
產線上發生的
Other(Enter issue in Full Descripteion of Issue)
Did device initial incoming inspection?
Did device at customer electrical test? (Describe detail of the tests)
Did device programming?
燒錄站時,異常狀況
ICSP? On Board? Tools?
Was the device soldered on board?
"儘量"不接受客戶整片板子送FA
Did application work with a replacement(A/B/A Swap)?
確認問題是跟著 IC? Board? 走
還要確認交換後, "issue" 是否一致?
Full Description of the Issue (Data in)
Device 哪裡有 Failure?
可另外附檔案(波形、訊號、…)
要登入 Sales force 前,要先註冊 MyMicrochip
http://microchip.lightning.force.com
Incoming Read:
讀取內部的 Flash/EEPROM
ATE Testing item 是 confidential 不提供給客戶
Optical Inspection:
開蓋檢查
EMMI
異常的會產生 Hot spot
(好壞作比較,燒相同的code)
Layout Analysis:
分析亮點是不是在 ADC module 的區塊裡,
"Location of defect "adc_sarcore" "
Particle defect
製成過程中,有灰塵掉落DIE 上
FIB/TEM
另外2台儀器, 作分析