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FAILURE ANALYSIS REQUEST & INFORMATION FORM

2021/09/01 Presenter: Leah Hong


  • Full Customer company name (Name appearing on report):
    客戶的全名
    Ex: Lite-On tech co. ltd.

  • Customer contact name:
    填代理商 FAE/Sales

  • E-mail address( register an MyMicrochip account):
    填寫 有註冊過"MyMicrochip"

  • Application Details of this part:
    填寫詳細的應用產品

  • Automotive Customer?
    車用的產品則一定要勾選

  • Special Instructions for FA If Yes, please describe:
    Ex: 非常溫下,在高溫 - 80℃
    分析過程中,一定要特別註明的

  • Customer Part #:
    客戶廠內的 Part No.

  • Microchip Part no (CPN)#:

  • Customer Tracking #:
    客戶自己的FA追蹤碼,若沒有 可不寫

  • Failure Rate (rej qty/total qty):
    發生issue的數量/工廠當批生產的數量

  • How many sample for FA:
    送分析的數量

  • Trace code of FA sample: Qty:
    填寫 送分析IC的上面的 trace code yymmxxx (Date code + rand number)
    Ex: 送3顆,有2種 trace code : 2103QWE x 1pcs, 2109ASD x 2pcs
    Trace code of FA sample: 2103QWE Qty: 1
    Trace code of FA sample: 2109ASD Qty: 2

Package : CSP 包裝太小,看不到 Trace code 要請客戶自己記錄下來,在出貨的外包裝上有註明。

P.S. 提供"assembly lot number"也是可以。

  • 生產線有問題,是看當下的生產線上的量

  • Engineering Samples
    客戶自己的"Enginnering Samples"
    有可能非經正常的生產線測試, 所以要特別註記

  • Field Failure( Enter using hours or Km in Full Descriptions of Issue)
    是 relibiltiy 問題

  • Assembly Plant (0 km)

  • Line Pull(PCBA)
    產線上發生的

  • Other(Enter issue in Full Descripteion of Issue)

  • Did device initial incoming inspection?

  • Did device at customer electrical test? (Describe detail of the tests)

  • Did device programming?
    燒錄站時,異常狀況
    ICSP? On Board? Tools?

  • Was the device soldered on board?
    "儘量"不接受客戶整片板子送FA

  • Did application work with a replacement(A/B/A Swap)?
    確認問題是跟著 IC? Board? 走
    還要確認交換後, "issue" 是否一致?

  • Full Description of the Issue (Data in)
    Device 哪裡有 Failure?
    可另外附檔案(波形、訊號、)

要登入 Sales force 前,要先註冊 MyMicrochip
http://microchip.lightning.force.com

  • Incoming Read:
    讀取內部的 Flash/EEPROM

  • ATE Testing item 是 confidential 不提供給客戶

  • Optical Inspection:
    開蓋檢查

  • EMMI
    異常的會產生 Hot spot
    (好壞作比較,燒相同的code)

  • Layout Analysis:
    分析亮點是不是在 ADC module 的區塊裡,
    "Location of defect "adc_sarcore" "

  • Particle defect
    製成過程中,有灰塵掉落DIE 上

  • FIB/TEM
    另外2台儀器, 作分析