[ELKA] POSTER KK ELEKTRONIKA

# [ELKA] POSTER KK ELEKTRONIKA # Bidang Keilmuan KK: To Study Microelectronic System, Electronic Materials, Design and Implementation of Application Specific Integrated Circuits (ASIC), System-on-a-Chip (SoC) and Electronic Instrumentation. # Sekilas KK Elektronika Kelompok riset elektronika berfokus pada Digital dan Analog IC Design, Teknologi Pemrosesan IC, dan Sistem Tertanam. Bidang penelitian meliputi Perancangan Arsitektur Sistem Elektronika, System on Chip (SoC), Optimalisasi Algoritma untuk implementasi perangkat keras, Perancangan VLSI, Hardware Software Co-Design, serta Perancangan dan Implementasi Perangkat keras. Penelitian-penelitian tersebut ditargetkan untuk berbagai aplikasi mutakhir seperti Baseband Chip untuk Advance Wireless System (5G and 6G), Artificial Intelligence Accelerator,Internet of Things (IoT), Smart Card, Security Engine, Wireless Sensor Network, dan Silicon Nano Wire. ## Visi Mengembangkan keilmuan terkait Sistem dan Aplikasi dunia fisik berbasis Teknologi Elektronik  ## Misi 1. Mengembangkan rancang bangun komponen (chip) elektronika 2. Mengembangkan rancang bangun sistem terintegrasi pada level chip dan board menggunakan pendekatan hardware dan software 3. Mendukung perkembangan ekosistem industri elektronika berteknologi tinggi di Indonesia. 4. Berkontribusi menyediakan sumber daya manusia trans-nasional di industri elektronik global. 5. Berfokus pada penelitian produk elektronik produksi massal. # Research Group ## 1. Analog and Digital IC Design The group is focusing on R&D in IC technology field using Computer-Aided Design (CAD) tools. IC is a miniaturized electronic circuit constructed from many transistors on semiconductor platform. Our R&D covers IC technology exploration such as modelling, design, optimization, verification and implementation. Our major competence cover analog, digital, mixed-signal and RF circuits design for developing a judicious chip. The research interest are on the analog and digital ASIC, FPGA based solutions, System-on-Chip (SoC) and their various applications. We have experiences in designing prototypes and products, such as WiMAX chipset, smart card, etc. Currently we are developing chipset for Internet-of-Things (IoT) and Visible Light Communications (VLC). ### Competencies The group has competencies in Analog and Digital circuits design, Digital Architecture, Full and Semi-Custom design, implementations, FPGA prototyping, Design Test, Low power and High Speed Design synthesis, Placement and Routing, etc. ### Research Topics - Analog and digital ASIC design - FPGA based prototyping - System-on-Chip (SoC) - Chipset for Internet-of-Things (IoT) - Visible Light Communication (VLC) - Smartcard - Wireless Communication (OFDM, LTE, WiMAX) ## 2. Device dan IC Processing Technology Device and IC Processing Technology Research Group focused on developing technology for analysis, characterization, design, modelling, and fabrication of microelectronic devices, sensors, and integrated circuits in micro and nano scale. In supporting the development of local electronics industry, this group is involved in the construction of Indonesian wafer fab with a production capacity of CMOS technology-based chips to supply the needs of the domestic chips for smartcard applications. This group also aimed in promoting IC and semiconductor fabrication technology to local human resources required by future electronics industry. ### Competencies The IC processing Technology Research Groups has competencies in almost every aspect of Silicon and other semiconductor fabrication processing technology: material and device physics, simulation, and fabrication process both in micro and nano scale; physics and simulation of novel quantum devices, growth and preparation nano material. The group also capable of developing fabrication process for several CMOS based IC manufacturing technology. ### Research Topics - Quantum and novel electronics devices design and modelling - Silicon nanowire fabrication and application in electronics - Electronics application of nano material - MEMS-based sensor devices - CMOS technology and processing ## 3. Electronic Manufacturing Technology This research group was formed with the aim to help local electronic industries to master the technology, to improve the human resource competency and also to develop the local industries to produce electronic manufacturing equipment in the long term. The specific technology that has been developed covers IC packaging, multilayer PCB, and electronic assembly. This research group has successfully established a teaching factory in the state Polytechnics Batam. There are a number of specific advance research topics to be pursued in near future include: advanced IC packaging, and HDI (High Density Interconnect) PCB and electronic board assembly. ### Competencies The research group also has program to give competency training with certification in a number of topics which include the basic technology, equipment, and quality control aspects (e.g. Statistics Process Control/Sixsigma, Design of Experiments) ### Research Topics Currently, this research group is conducting process development for manufacturing low cost microcontroller boards, including Arduino and ARM-based microcontroller boards. Apart from this, this research group is also developing prototypes if CNC based PCB milling machines, Chip-Mounter (Pick and Place) and AOI (Automatic Optical Inspection) for education laboratories. ## 4. Radio Frequency Integrated Circuit RF IC Research Group concentrates on design, simulation and synthesize work on microelectronics RF- device and integrated circuits. Current focus of research and development encompasses broadband rf amplifier, large-signal rf amplifier, multimode front-end switching, high speed RF MIMO for data transfer, RF IC for IoT and signal integrity of broadband through multi-layer, multi-stack and 3D integration of rf microelectronics. RF IC Research Group involves undergraduate and graduate doctoral students doing research on RF devices and microelectronic circuit integration supported by 'state of the art' broadband 4G LTE and vector network-measurement facilities. ### Competencies - Broadband and Large Signal Non-linearity (Linear Amplifier Design). - RF Broadband and Multimode Wireless Access – 4G (LTE), 5G. - Multi-layer, multi-stacked and 3D interconnect and integration structure, characterization-analysis and manufacturing. - RF – High Speed transistor Modelling, Design and Fabrication. ### Research Topics - Broadband RF Amplifier Design and Implementation. - Large Signal RF Power Amplifier Design, Simulation and Fabrication. - Non-linearity effect of large signal and broadband RF Amplifier. - High Speed RF Memory and IoT Control-Data access and transfer. - Characterization, Analysis and Design of Multilayer, multi-stack and 3D RF and Mixed Signal Integration structure. ## 6. Secure Device The research-group focus is on hardware security and cyber physical system security, with a emphasis on the implementations of cryptographic algorithms and cryptographyc scheme. It includes blockchain and crypto asset, modern hardware design, hardware design of cryptographic algorithms and arithmetic units in FPGAs, side channel analysis, hardware intellectual property protection, hardware trojans, and physically unclonable functions. With the number of increasing of e-business practices, great volumes of secure business transactions and data transmissions are routinely carried out in an encrypted form in devices ranging in scale from personal smartcards to business servers. These cryptographic algorithm are often computationally intensive and are designed in hardware and embedded systems to meet the real-time requirements. ### Competencies The group has competencies in mathematical background and cryptographic algorithms including blockchain and crypto asset, modern hardware design, side channel analysis, hardware intellectual, property protection, hardware trojans, Physically Unclonable functions,HW/SW Codesign and real-time design. ### Research Topics - Blockchain and Crypto Asset - Side Channel Attack and Analysis (power, electro magnetics, timing) - Vulnerability Analysis - HW/SW Codesign - Real-time security Systems - Differential Fault analysis - Secure CPS - Secure Cloud FPGA - Hardware trojan ## Anggota dan Keahlian | No | Nama | Keahlian |Spesialisasi| | -------- | -------- | -------- |-------| | 1 | Trio Adiono | IC Design, Wireless communication | |2| Adi Indrayanto | Electronics Industry, Embedded Devices/System| |3| Akhmadi Surawijaya | Device Micro Electronic, Device Photonic, Lab on Chip |4| Arif Sasongko | Digital Design| |5| Elvayandri Muchtar |Electronic, Instrumentation, Computation|Electronica and Computation|2011|2023|2026 |6| Farkhad Ihsan Hariadi | Smart Grid, Hardware Machine Learning, Manufacture| |7|Infall Syafalni | IC Design, Circuit Optimization and Automation, Logic Design, VLSI Design, Optimization Algorithm| Efficient Circuits & Algorithms | |8|Irman Idris| Solar Cell,Energy Storage and Conservation, LED, Sensor, Microelectronic Fabrication| |9| Mervin Tangguar Hutabarat| RFIC Design, Engineering Education | |10|Muhammad Amin Sulthoni| Nanoelectronics, Semiconductor Devices Processing and Simulation,Electronics Materials | |11|Muhammad Iqbal Arsyad|Electronic System Engineering, Engineering Design|Edge Computing|2021|2027|2030|2035| |12|Nana Sutisna|VLSI Design, Baseband Wireless System, Hardware/Software Co-Design, VLSI Architecture, AI Hardware Accelerator| |13|Sarwono Sutikno | Hardware Security,Information Security, Information Risk Management, Internal Audit|Keamanan Hardware| | |2010| 2023 |14|Trio Adiono| Wireless Communication Baseband Design, AI Processor Accelerator,Visible Light Communication, IoT Embedded System| |15|Waskita Adijarto| AI for Image Processing and Recognition, Object Detection, Embedded System| |16|Yusuf Kurniawan | Hardware Security & Cryptography| |17|Nur Ahmadi|| ## Road Map | Tahun | Keilmuan | Teknologi | Produk| Market| | -------- | -------- | -------- | --------| --------| |2022|||Hardware Security dan Implementasi Kripto| | 2022 | Chip Design | VLC | High Speed Wireless Communication |Consumer and Military | | 2022 | Chip Design | AI (CNN,RL,RNN,DQN) | Accelerator Chip |Robotic | | 2022 | Chip Design | FHE | Secure Communication / Cloud |E-Commerce | | 2022 | Teknologi Divais Semikonduktor | Sensor Photonic| Wearable Device | Medical| | 2022 | Teknologi Divais Semikonduktor | Electro Wetting Device|Wearable Device | Medical| | 2022 | Teknologi Divais Semikonduktor | IoT|Smart Farming | Pertanian| |20|Embedded System on Chip| |20|Keamanan dan Sistem Elektronika| |20|Elektronika Industri dan Aplikasi| ## ISESD about ## Graduate Program This Program is to expand the collaboration and increase the quality of graduatee student. The program is lso to attract more student into Microelectronics graduate program. Cooperation has been done with several university such as; NTU, NTUST, Sibaura university, JAIST wct. Program - Dual degree - Double Degree - Internship - Exchange Student ## Latest Journal and Publication ## Photo Galery ISSED 2022