# **Fault Detection & Classification (FDC)**

Fault Detection &Classification monitors various sensor data coming from the equipment continuously, analyze them and apply user-defined limits to them to detect process excursions. This system also allows engineers to configure actions that must be taken when a certain parameter is OOC (out of control) and FDC system automatically takes user defined actions. Process Excursion could be a result of one or more of a degrading equipment part, a process or equipment issue of the wafer/die from any of the previous steps, etc. Detecting such excursions and notifying appropriate fab or assembly/test personnel could result in preventing yield loss, improving cycle-time, OEE and equipment up-time.

eInnoSys has successfully implemented several **[Fault Detection & Classification](https://www.einnosys.com/fault-detection-classification-fdc/)** (FDC) projects at various fabs. Our Fault Detection and Classification (FDC) systems

**How it works**

eInnoSys designed FDC system continuously monitors various equipment sensor data either received through [**SECS/GEM**](https://www.einnosys.com/introduction-secs-gem/) or directly from the sensor

This system allows engineers to define what kind of analysis must be performed as the data is received and also define lower and upper control limits

FDC system also allows engineering to configure what actions must be taken automatically when a certain parameter is OOC (out of control). The action could be any combination of
– put the equipment in unscheduled maintenance, notify an engineer, hold wafers or packages for engineering review, etc.

**Case Studies**

At one wafer fab, eInnoSys implemented Fault Detection and Classification (FDC) helped them improve equipment uptime by 20 hours per month

At another wafer fab, our FDC system helped them reduce scrap of 160 wafers per year